We share here the recent news of our members: our initiatives, events and shared successes which make EURECOM a stimulating environment, rich in innovation and sharing and, at the crossroads of everyone's ambitions!
Industry Forum 2023
42 students in the Industry Forum team and EURECOM staff welcomed 17+ companies and 250 students for the annual event tailored to meet and discuss more about internships and career opportunities. Thanks to all companies, among them, Orange, Amadeus, ST Microelectronics, SAP, etc. this edition was a great success and strengthened the strategic relationships between these companies and EURECOM.
TechForward: new call for application
While the EDHEC-EURECOM-IMT incubator is still accompanying the previous entrepreneurs, the next batch of candidates can send their applications between 4 Dec 2023 and 21 January 2024 for onboarding in February 2024. All deadlines and pre-registration form are available online.
Qualcomm & STMicroelectronics
New godfather companies for the newly arrived Class of 2026 engineers and Class of 2025 students, respectively supported by Qualcomm and ST Microelectronics.
EURECOM students received a warm welcome from their godfather companies which will accompany them during their studies, with dedicated meetings, internship opportunities and much more!
EURECOM-EDHEC: signature of a double degree "engineer-manager"
Strengthening of collaboration between the two schools to offer a unique diploma combining technological expertise and management. This Master's degree opens on Sept 2023 with a selection of students targeting management positions in industries.
David Gesbert, EURECOM Director (left) and Emmanuel Métais, Dean of EDHEC Business School (right)
After several remote meetings, the consortium members were invited to the Technical University of Wien (TU Wien) for the annual meeting. A guided tour of the TU Wien Science Center where Austria's largest supercomputers (VSC-4 and -5) are used to solve and coordinate highly complex tasks.
While the first class of innovative projects was a great success, the TechForward incubator, born thanks to the partnership between EURECOM-IMT-EDHEC, will welcome its next startups this summer. All startups will benefit from high-level coaching to launch their tech project addressing major issues for the future. Follow them #techforward
BMW Group is one of the EURECOM consortium's industrial members. M. Hendrik Schweppe, General Manager for the Connected Vehicle Offboard Dpt and graduated from EURECOM, shared his expertise and career opportunities within his group.
Data science is Amadeus DNA and our students were amazed to discover such a range of expertise in working with them! Thanks to our two EURECOM Alumni, M. François (class of 2006) and M. Lardy (2022), they discovered more about data security, coding and DevOps engineers' skills required.
Aalto University, a historical member at EURECOM
Ms. Eeva Halonen met EURECOM Director, David Gesbert and the International office to exchange experiences on good practices related to mobility exchanges, cooperation, and European programs. She also presented to our first-year engineers the mobility opportunities offered thanks to EURECOM - Aalto University academic agreements and how to get prepared to study and live in Finland.
Ms.Eeva Halonen, Planification officer, Aalto University (Finland) with the first-year engineers.
Orange delegation hosted at EURECOM
EURECOM's consortium historical member Orange teamed up with EURECOM to develop future open-source open-RAN wireless networks. The Communication Systems Dept. led by EURECOM professor and OpenAirInterface Software Alliance president, Mr. Raymond Knopp, hosted Orange's delegation led by Orange's VP Green & Radio Networks, Ms. Elisabeth Py.
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