Actualité de membres

Nous partageons ici l'actuallité récente de nos membres: nos innitiatives, évènements et succès partagés qui font d'EURECOM un environnement stimulant, riche en innovation et partage et, à la croisée des ambitions de chacun!

 

Motonobu KanagawaEURECOM Prof. M. Kanagawa won the Chris Daykin Prize from the International Actuarial Association, together with Prof An Chen (Institute of Insurance Science - Ulm University) and Dr Fangyuan ZHANG (EDHEC-Risk Climate Impact Institute), for the paper :“Intergenerational Risk Sharing in a Defined Contribution Pension System: Analysis with Bayesian Optimization” published in the ASTIN Bulletin: the Journal of the International Actuarial Association.

 

 

Logo Forum des entreprises

Industry Forum 2023

42 students in the Industry Forum team and EURECOM staff welcomed 17+ companies and 250 students for the annual event tailored to meet and discuss more about internships and career opportunities. Thanks to all companies, among them, Orange, Amadeus, ST Microelectronics, SAP, etc. this edition was a great success and strengthened the strategic relationships between these companies and EURECOM.

 

TechForward

TechForward: new call for application

While the EDHEC-EURECOM-IMT incubator is still accompanying the previous entrepreneurs, the next batch of candidates can send their applications between 4 Dec 2023 and 21 January 2024 for onboarding in February 2024. All deadlines and pre-registration form are available online.

 

 

 

logos Qualcomm - ST Microelectronics

Qualcomm & STMicroelectronics

New godfather companies for the newly arrived Class of 2026 engineers and Class of 2025 students, respectively supported by Qualcomm and ST Microelectronics.
EURECOM students received a warm welcome from their godfather companies which will accompany them during their studies, with dedicated meetings, internship opportunities and much more!

 

DD EURECOM-EDHEC EURECOM-EDHEC: signature of a double degree  "engineer-manager"

Strengthening of collaboration between the two schools to offer a unique diploma combining technological expertise and management. This Master's degree opens on Sept 2023 with a selection of students targeting management positions in industries.

David Gesbert, EURECOM Director (left) and Emmanuel Métais, Dean of EDHEC Business School (right)

 

Assemblée des membres juin 2023The Assembly of Members 2023 held in TU Wien

After several remote meetings, the consortium members were invited to the Technical University of Wien (TU Wien) for the annual meeting. A guided tour of the TU Wien Science Center where  Austria's largest supercomputers (VSC-4 and -5) are used to solve and coordinate highly complex tasks.

 

 

TF visualTechForward: the 2nd class of startups onboards on July

While the first class of innovative projects was a great success, the TechForward incubator, born thanks to the partnership between EURECOM-IMT-EDHEC, will welcome its next startups this summer. All startups will benefit from high-level coaching to launch their tech project addressing major issues for the future. Follow them #techforward

 

 

BMW companies cornerBMW Group: meeting mentors for a brilliant career

BMW Group is one of the EURECOM consortium's industrial members. M. Hendrik Schweppe, General Manager for the Connected Vehicle Offboard Dpt and graduated from EURECOM, shared his expertise and career opportunities within his group.

 

Amadeus Companies cornerAmadeus Engineer: alumni feedback!

Data science is Amadeus DNA and our students were amazed to discover such a range of expertise in working with them!  Thanks to our two EURECOM Alumni, M. François (class of 2006) and M. Lardy (2022),  they discovered more about data security, coding and DevOps engineers' skills required.

 

 

Aalto university visiitAalto University, a historical member at EURECOM

Ms. Eeva Halonen met EURECOM Director, David Gesbert and the International office to exchange experiences on good practices related to mobility exchanges, cooperation, and European programs. She also presented to our first-year engineers the mobility opportunities offered thanks to EURECOM - Aalto University academic agreements and how to get prepared to study and live in Finland.

Ms.Eeva Halonen, Planification officer, Aalto University (Finland) with the first-year engineers.

 

Orange delegation Orange delegation hosted at EURECOM

EURECOM's consortium historical member Orange teamed up with EURECOM to develop future open-source open-RAN wireless networks. The Communication Systems Dept. led by EURECOM professor and OpenAirInterface Software Alliance president, Mr. Raymond Knopp, hosted Orange's delegation led by Orange's VP Green & Radio Networks, Ms. Elisabeth Py.

 

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